Evaluation of material properties for particle dispersed composite using homogenization method
Evaluation of material properties for particle dispersed composite using homogenization method
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采用均化法评价颗粒分散复合材料的材料性能
DOI：
10.1299/kikaia.66.2151
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发表时间：
2000
期刊：
影响因子：
--
通讯作者：
M. Shiratori
中科院分区：
文献类型：
--
作者：
Y. Kaga;J. Gotoh;Qiang Yu;M. Koishi;M. Shiratori
提出了一种能有效评价均质化材料性能和复合材料微观应力应变的均匀化方法。另一方面，颗粒分散复合材料经常被用于许多工业领域，例如电子封装的模压树脂。为了估计下一阶段的微观应力/应变，作者尝试评估了由含二氧化硅的环氧树脂制成的颗粒分散复合材料的弹性模量和导热系数的等效材料性能。此外，通过对混合物的实验测量和理论规律验证了数值方法的有效性。在均化理论框架下，利用有限元分析方法，成功地计算了任意体积分数填料的等效弹性模数和导热系数。
The homogenization method has been developed to evaluate effectively both homogenized material properties and microscopic stress/strain of composite materials. On the other hand, a particle dispersed composite is often used in many industrial field, such as molding resins for electronic packaging. The authors attempted to evaluate equivalent material properties of an elastic modulus and a thermal conductivity of the particle dispersed composite made of an epoxy resin including a silica, in order to estimate the microscopic stress/strain in the next stage. Moreover the validity of the numerical method will be assured with experimental measurements and theoretical rule of mixtures. The equivalent modulus and thermal conductivity are successfully evaluated using the finite element analysis by a framework of the homogenization theory at any volume fractions of filler.