Analytical thermal stress modeling in electronics and photonics engineering: Application of the concept of interfacial compliance
Analytical thermal stress modeling in electronics and photonics engineering: Application of the concept of interfacial compliance
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DOI：
10.1080/01495739.2018.1525331
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发表时间：
2019-01
影响因子：
2.8
通讯作者：
E. Suhir
中科院分区：
文献类型：
--
作者：
E. Suhir
摘要讨论了界面柔度概念在电子与光子工程热应力分析建模中的应用。该评论主要基于作者在贝尔实验室（基础研究，第11区，默里山，新泽西州），加州大学（圣克鲁斯，加利福尼亚州），波特兰州立大学（波特兰，OR）和小型企业创新研究（SBIR）ERS公司任职期间进行的研究。
Abstract Application of the concept of interfacial compliance in analytical thermal stress modeling in electronics and photonics engineering is addressed. The review is based mostly on the author’s research conducted during his tenure with Bell Labs (Basic Research, Area 11, Murray Hill, NJ), University of California (Santa Cruz, CA), Portland State University (Portland, OR), and Small-Business-Innovative-Research (SBIR) ERS Co. The emphasis is on practically important, but often non-obvious and sometime even paradoxical situations.