Study on Resist Removal Using Electrolyzed Sulfuric Acid Solution in Comparison with SPM
Study on Resist Removal Using Electrolyzed Sulfuric Acid Solution in Comparison with SPM
复制标题
电解硫酸溶液去除抗蚀剂与SPM的比较研究
DOI：
10.4028/www.scientific.net/ssp.187.109
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发表时间：
2012
期刊：
影响因子：
--
通讯作者：
H. Morita
中科院分区：
文献类型：
--
作者：
T. Nagai;Haruyoshi Yamakawa;M. Uchida;Toru Otsu;N. Ikemiya;H. Morita
众所周知，SPM的抗蚀剂去除能力在剥离过程中逐渐恶化。理论上，这种劣化被解释为硫酸浓度的降低。相反，在电解硫酸法的情况下，硫酸和通过电解产生的过二硫酸的浓度都保持恒定，因此即使不添加过氧化氢，也可以长期维持抗蚀剂去除能力。事实证明，在φ300mm晶圆上形成图案并以1E14原子/cm2注入的抗蚀剂可以使用电解硫酸溶液去除，而无需灰化过程。
It is known that resist removal capability of SPM gradually deteriorates during the stripping process. The deterioration is theoretically explained to be the decrease in the concentration of sulfuric acid. On the contrary, in the case of electrolyzed sulfuric acid method, both concentrations of sulfuric acid and of peroxodisulfuric acid produced by electrolysis are kept constant, so that the resist removal capability is maintained for a long term even without addition of hydrogen peroxide. It is proved that resist patterned on φ300mm wafers and implanted at 1E14 atoms/cm2 can be removed using electrolyzed sulfuric acid solution without ashing process.