A Self-Aligning Flip-Chip Assembly Method Using Sacrificial Positive Self-Alignment Structures
A Self-Aligning Flip-Chip Assembly Method Using Sacrificial Positive Self-Alignment Structures
复制标题
一种使用牺牲正自对准结构的自对准倒装芯片组装方法
DOI：
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发表时间：
2016
期刊：
影响因子：
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通讯作者：
M. Bakir
中科院分区：
文献类型：
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作者：
H. Yang;Chaoqi Zhang;M. Bakir
描述了一种自对准倒装芯片组装方法。该方法能够在倒装芯片组装过程中校正高达150 μm（所用焊球半径的5倍）的初始未对准。自对准的关键组件是四个聚合物正自对准结构（PSAS），这是在衬底上制造的，和四个倒金字塔坑，这是在相应的位置蚀刻在硅芯片上。组装后，使用溶剂移除PSAS。焊点的电阻测量值低于9 mΩ。
A self-aligning flip-chip assembly method is described. The method is capable of correcting up to 150 μm (five times the radius of solder balls used) of initial misalignment during flip-chip assembly. Critical components of the self-alignment are four polymeric positive self-alignment structures (PSASs), which are fabricated on a substrate, and four inverted pyramid pits, which are etched on a silicon chip in corresponding positions. The PSAS is removed using solvent after the assembly. Resistance of the solder joints is measured to be below 9 mΩ.