Technical Change Management for the Maintenance of Product Platforms

Technical Change Management for the Maintenance of Product Platforms
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产品平台维护的技术变更管理

DOI:
10.1016/j.procir.2017.01.025
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发表时间:
2017
期刊:
Procedia CIRP
影响因子:
--
通讯作者:
Aleksic
Aleksic
中科院分区:
--
文献类型:
--
作者:
Riesener;Tönnes;Aleksic

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为了一方面应对日益激烈的全球竞争,另一方面应对日益增长的个性化产品需求,产品平台成为开发产品系列的一个成熟的设计概念。通过使用模块化原则,公司能够在开发和生产中实现协同作用,同时提供各种各样的产品。因此,模块化产品架构的初始设置的方法和途径在科学文献中有很好的介绍。然而,可以确定的是,缺乏对产品平台的可持续维护和持续开发的研究。因此,大多数公司没有一个结构化的发布管理系统的技术变更和修改模块的物理产品。为了保持已实施产品平台的成功,必须计划变更的引入。在本文中,介绍了一种新的方法,用于同步模块的生命周期与各自的平台产品的生命周期。这种方法的目标是最大限度地增加技术变化的数量,这些技术变化可以在某个时间实施到现有模块化产品平台的产品中,同时最大限度地减少开发成本以及生产中的变化工作。最后,展示了如何将物理上改变的模块发布到模块化产品平台的不同产品线中的策略。
In order to react to an increasing global competition on the one hand and an increasing demand for individual products on the other hand, product platforms became a well-established design concept for developing product families. By using the principle of modularization companies are able to achieve synergies within development and production and at the same time offer a wide variety of products. Therefore, approaches and methods for the initial setup of modular product architectures are well covered in the scientific literature. Nevertheless, a lack of research can be identified for the sustainable maintenance and continuous development of product platforms. Accordingly, most companies do not have a structured release management for the systematic introduction of technical changes and modified modules of physical products. In order to preserve the success of an implemented product platform, it is mandatory to plan the introduction of changes. In this paper, a new method is introduced for synchronizing the lifecycle of modules with the lifecycle of the respective platform products. The goal of this approach is to maximize the number of technical changes which can be implemented into products of an existing modular product platform at a certain time while minimizing development costs as well as changing efforts within production. At the end strategies are shown how to release physically changed modules into different product lines of a modular product platform.
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