Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging
Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging
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DOI：
10.1016/j.compfluid.2007.07.007
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发表时间：
2008-06
影响因子：
2.8
通讯作者：
T. Hashimoto;Tanifuji Shin-ichiro;K. Morinishi;N. Satofuka
中科院分区：
文献类型：
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作者：
T. Hashimoto;Tanifuji Shin-ichiro;K. Morinishi;N. Satofuka
本文提出了一种数值模拟倒装芯片封装中传统毛细流动和非流动两种封装方式下芯片内部流动的方法。提出了这两种封装工艺的解析模型。在毛细流动型中，焊料材料通过表面张力被驱动到具有焊料凸块的空腔中，接触角的作用为毛细作用。在非流动型中，通过适当的加载来控制IC芯片在回流附接期间的移动，以获得IC芯片与基板之间的适当互连。在这两种类型中，考虑到流体动力学作用于焊料凸点，研究了底部填充封装过程中焊料的流动行为和填充时间。据发现，所提出的分析模型有相当大的潜力，用于预测湍流。
We developed a numerical method for simulating the underfill flow of conventional capillary flow and no-flow types in flip-chip packaging. The analytical models for the two types of underfill encapsulation processes are proposed. In the capillary flow type, the underfill material is driven into the cavity with solder bump by the surface tension with an effect of contact angle as the capillary action. In the no-flow type, the movement of IC chip during the reflow attachment is controlled by an appropriate loading to get the proper interconnect between IC chip and substrate. In both types, the flow behavior and filling time of underfill material in underfilling encapsulation process are investigated, taking the fluid dynamic force acting on the solder bump into account. It is found that the proposed analytical models have a considerable potential for predicting the underfill flow.