Investigation of hexagonal boron nitride as an atomically thin corrosion passivation coating in aqueous solution
Investigation of hexagonal boron nitride as an atomically thin corrosion passivation coating in aqueous solution
复制标题
DOI：
10.1088/0957-4484/27/36/364004
复制
发表时间：
2016-08
期刊：
影响因子：
3.5
通讯作者：
Jing Zhang;Yingchao Yang;J. Lou
中科院分区：
文献类型：
--
作者：
Jing Zhang;Yingchao Yang;J. Lou
在这项研究中，使用了六方氮化硼（h-BN）原子层作为钝化涂层。采用化学气相沉积法在镍箔上制备了大面积连续h-BN薄膜，并将其转移到溅射铜上作为腐蚀钝化膜。采用循环伏安法（CV）、塔菲尔极化法（Tafel polarization）和电化学阻抗谱（EIS）等电化学方法研究了裸铜和涂层铜在Na 2SO 4溶液中的腐蚀钝化性能。CV和Tafel分析表明h-BN涂层能有效抑制铜的阳极溶解。EIS拟合结果表明，缺陷是h-BN薄膜的主要漏电源，进一步钝化这些缺陷可以提高h-BN薄膜的耐腐蚀性能。
Hexagonal boron nitride (h-BN) atomic layers were utilized as a passivation coating in this study. A large-area continuous h-BN thin film was grown on nickel foil using a chemical vapor deposition method and then transferred onto sputtered copper as a corrosion passivation coating. The corrosion passivation performance in a Na2SO4 solution of bare and coated copper was investigated by electrochemical methods including cyclic voltammetry (CV), Tafel polarization and electrochemical impedance spectroscopy (EIS). CV and Tafel analysis indicate that the h-BN coating could effectively suppress the anodic dissolution of copper. The EIS fitting result suggests that defects are the dominant leakage source on h-BN films, and improved anti-corrosion performances could be achieved by further passivating these defects.