Microscale analysis of influence of wettability on flow behaviours of molten Cu infiltrating into W channel
Microscale analysis of influence of wettability on flow behaviours of molten Cu infiltrating into W channel
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DOI：
10.1179/1743284713y.0000000425
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发表时间：
2014-03
影响因子：
1.8
通讯作者：
Y. Bai;S. Liang
中科院分区：
文献类型：
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作者：
Y. Bai;S. Liang
为了更好地了解Cu和W之间的润湿性对CuW合金制备过程中熔渗过程的影响，基于修正的Navier-Stokes方程，采用有限体积法模拟了Cu和W之间4种不同接触角下，W微通道内Cu液的流动形态，并研究了Cu液中Co含量对流动前沿的影响。结果表明，Cu和W之间较小的接触角增加了在流动前沿产生的压差和负压，从而提高了流动速度，缩短了制备CuW合金的浸渗时间。但接触角越小，浸渗过程中越容易产生较大的负压，不利于Cu液在W通道中的填充。此外，Co的加入可以加速熔融铜在W通道中的流动，由于增加的压差。
In order to better understand the effect of the wettability between Cu and W on the infiltration process during the fabrication of CuW alloy, the flow patterns of molten Cu in the W microchannel at four different contact angles between Cu and W were simulated by finite volume method based on the modified Navier–Stokes equation, and the effect of Co content in molten Cu on the flow front was studied as well. The results show that the less contact angle between Cu and W increases the differential and negative pressures generated at the flow front and thus increases the flow velocity and decreases the infiltration time during the fabrication process of CuW alloy. However, the less contact angle is easier to cause a larger negative pressure with the progress of the infiltration process, which is not favourable for the filling of molten Cu in the W channel. In addition, Co addition can accelerate the flow of molten Cu in the W channel due to the increased differential pressure.