Deformation and fracture behaviour, and thermal stability of ODS-Cu/ODS-Cu and SUS/ODS-Cu joints fabricated by advanced brazing technique
Deformation and fracture behaviour, and thermal stability of ODS-Cu/ODS-Cu and SUS/ODS-Cu joints fabricated by advanced brazing technique
复制标题
采用先进钎焊技术制造的 ODS-Cu/ODS-Cu 和 SUS/ODS-Cu 接头的变形和断裂行为以及热稳定性
DOI：
10.1016/j.fusengdes.2022.113312
复制
发表时间：
2022
影响因子：
1.7
通讯作者：
the FFHR Design Group
中科院分区：
文献类型：
--
作者：
M. Tokitani;Y. Hamaji;Y. Hiraoka;S. Masuzaki;H. Tamura;H. Noto;T. Tanaka;T. Muroga;A. Sagara;the FFHR Design Group
氧化物弥散强化铜合金（ODS-Cu; GlidCop®）的接头，即，GlidCop®/GlidCop®接头以及不锈钢（SUS）和GlidCop®接头，即，SUS/GlidCop®接头采用先进钎焊技术（ABT）制备。采用三点弯曲试验、扫描电镜（SEM）和能谱仪（EDS）研究了接头的变形、断裂行为和热稳定性。首先，在GlidCop®/GlidCop®接头的情况下，塑性变形主要发生在具有较低硬度的扩散层中。断裂大约在扩散层的中心处进行。另一方面，在SUS/GlidCop®接头的情况下，塑性变形广泛地发生在本体、GlidCop®和SUS中，靠近本体和粘合层之间的界面。断裂主要沿着粘结层和本体GlidCop®之间的界面，并且基本上沿着粘结层和本体SUS之间的界面进行。其次，从微观结构和机械强度的角度，研究了第二步加热对GlidCop®/GlidCop®和SUS/GlidCop®接头的影响。扩散层（GlidCop®/GlidCop®接头）或粘合层（SUS/GlidCop®接头）的宽度以及第二步加热后这些层中的元素分布几乎没有明显变化。此外，两种接头的应力-应变曲线形状和屈服强度均未发生明显变化。
A joint of oxide dispersion strengthened copper alloy (ODS-Cu; GlidCop®), i.e., GlidCop®/GlidCop® joint and a joint of stainless steel (SUS) and GlidCop®, i.e., SUS/GlidCop® joint were prepared by using the advanced brazing technique (ABT). Deformation and fracture behavior, and thermal stability of these joints were investigated by means of three-point bending test, scanning electron microscope (SEM) and energy dispersive X-ray spectroscopy (EDS). Firstly, in the case of the GlidCop®/GlidCop® joint, plastic deformation occurred predominantly in the diffusion layer with lower hardness. The fracture proceeded approximately at the center of the diffusion layer. In the case of the SUS/GlidCop® joint, on the other hand, plastic deformation occurred widely in the bulks, GlidCop® and SUS near the interfaces between the bulk and the bonding layer. The fracture proceeded mainly along the interface between the bonding layer and the bulk GlidCop®, and substantially along the interface between the bonding layer and the bulk SUS. Secondly, influences of 2nd-step heat on the GlidCop®/GlidCop® and SUS/GlidCop® joints were examined from viewpoints of microstructure and mechanical strength. Almost no obvious changes in the width of the diffusion layer (GlidCop®/GlidCop® joint) or the bonding layer (SUS/GlidCop® joint), and in the element distribution in these layers after the 2nd-step heat were recognized. In addition, any obvious changes in the shape of stress-strain curve and yield strength were not recognized for both joints.
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