In situ tensile strength measurement and Weibull analysis of thick film and thin film micromachined polysilicon structures
In situ tensile strength measurement and Weibull analysis of thick film and thin film micromachined polysilicon structures
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DOI：
10.1016/s0040-6090(96)09076-1
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发表时间：
1997-01-05
期刊：
影响因子：
2.1
通讯作者：
Schweitz, JA
中科院分区：
文献类型：
--
作者：
Greek, S;Ericson, F;Schweitz, JA
介绍了一种可以对微机械结构进行原位拉伸试验的方法。测试设备由安装在扫描电子显微镜微操作臂上的测试单元组成。测量了由厚膜和薄膜多晶硅制成的微机械梁结构的断裂载荷，并通过测量断裂表面积计算了断裂强度。利用透射电子显微镜、原子力显微镜和扫描电子显微镜对薄膜材料进行表征，定位材料中的关键缺陷。利用威布尔统计量对断裂强度值的统计散点进行评估，得到平均断裂强度和威布尔模量——一种散射量的度量。本研究首次将威布尔理论应用于真实的微观力学结构，即将标准试验结果转化为更复杂结构的预期强度极限。
A method is introduced in which tensile tests can be performed in situ on micromachined structures. The testing equipment consists of a testing unit mounted on a micromanipulator in a scanning electron microscope. The fracture loads of micromachined beam structures made from thick and thin film polysilicon were measured, and the fracture strengths were then calculated via measurements of the fracture surface areas. Characterization of the film materials was also performed with transmission electron microscopy, atomic force microscopy and scanning electron microscopy to locate the critical defects in the materials. The statistical scatter of the fracture strength values was evaluated using Weibull statistics, which yielded the mean fracture strength and the Weibull modulus-a measure of the amount of scattering In this study, for the first time, Weibull theory was also applied to a real micromechanical structure, i.e. standard test results were transformed into expected strength limits of a more complex structure.