Numerical study on the measurement of thin film mechanical properties by means of nanoindentation
Numerical study on the measurement of thin film mechanical properties by means of nanoindentation
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DOI：
10.1557/jmr.2001.0408
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发表时间：
2001-10-01
影响因子：
2.7
通讯作者：
Vlassak, JJ
中科院分区：
文献类型：
--
作者：
Chen, X;Vlassak, JJ
纳米压痕是一种常用的测量薄膜硬度和刚度等机械性能的技术。在这项研究中，我们使用有限元方法来研究衬底和堆积对薄膜系统硬度和刚度测量的影响。我们定义了一个基材效应因子，并构建了一个地图，当无法使压痕足够浅以避免基材对测量的影响时，该地图可能有助于解释压痕测量。本文最后提出了一种利用纳米压痕法测量薄膜力学性能的新方法。
Nanoindentation is a technique commonly used for measuring thin film mechanical properties such as hardness and stiffness. In this study, we used the finite element method to investigate the effect of substrate and pileup on hardness and stiffness measurements of thin film systems. We define a substrate effect factor and construct a map that may be useful in the interpretation of indentation measurements when it is not possible to make indentations shallow enough to avoid the influence of the substrate on the measurements. A new technique for measuring mechanical properties of thin films by nanoindentation is suggested at the end of this article.