Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy
Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy
复制标题
与 SnPb 焊料合金熔化温度相当的 SnAgCu 无铅焊料合金纳米颗粒
DOI：
10.1016/j.jallcom.2009.05.042
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发表时间：
2009-09-18
影响因子：
6.2
通讯作者：
Schick, Christoph
中科院分区：
文献类型：
--
作者：
Gao, Yulai;Zou, Changdong;Schick, Christoph
采用耗材电极直流电弧（CDCA）技术制备纳米颗粒。结果表明，纳米SnAgCu钎料合金的热熔起始温度可低至179℃，与传统SnPb共晶合金的热熔起始温度（183℃）相当。此外，采用均匀熔融模型（HMM）和Gibbs-Thomson方程从理论上估计了纳米颗粒的尺寸相关熔化温度。利用高分辨率透射电镜（HRTEM）分析了纳米颗粒的结构和形态。CDCA技术在大量制备形状可控、尺寸小、粒径分布窄、成分接近无氧化物的纳米颗粒方面具有广阔的应用前景。这无疑为制造高质量的电子产品无铅焊料提供了一条新颖可行的途径。(C) 2009 Elsevier B.V.版权所有
Nanoparticles were prepared with a consumable-electrode direct current arc (CDCA) technique. The results showed that the calorimetric melting onset temperature of the nanoparticles of SnAgCu solder alloy could be as low as 179 degrees C, equivalent to that of the traditionally used SnPb eutectic alloy (183 degrees C). Moreover, the homogenous melting model (HMM) and Gibbs-Thomson equation were employed to theoretically estimate the size-dependent melting temperature of the as-prepared nanoparticles. The structure and morphology of the nanoparticles were analyzed with a high-resolution transmission electron microscopy (HRTEM). The CDCA technique showed promising prospect in manufacturing large amounts of nanoparticles with controlled shape, small size, narrow particle size distribution and nearly oxide-free composition. This undoubtedly puts forward a novel feasible approach to manufacture high quality lead-free solders for electronic products. (C) 2009 Elsevier B.V. All rights reserved.