Interface structure and surface morphology of (Co, Fe, Ni)/Cu/Si(100) thin films
Interface structure and surface morphology of (Co, Fe, Ni)/Cu/Si(100) thin films
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DOI：
10.1063/1.363548
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发表时间：
1996-11
影响因子：
3.2
通讯作者：
B. G. Demczyk;V. Naik;A. Lukaszew;R. Naik;G. Auner
中科院分区：
文献类型：
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作者：
B. G. Demczyk;V. Naik;A. Lukaszew;R. Naik;G. Auner
我们研究了通过分子束外延在氢端[100]硅衬底上沉积的双层Co/Cu、Fe/Cu和Ni/Cu薄膜。采用原子分辨透射电子显微镜对磁性金属/铜界面进行了检测，并与原子力显微镜所描绘的表面形貌进行了比较。发现磁性金属/铜界面上的一般取向关系为：[001]Co， Ni∥[001]Cu；（010） Ni∥(010)Cu和[001]Fe∥[001]Cu；(110)菲∥(200)铜。后一种系统相当于[11]Fe∥[011]Cu和（110）Fe∥(100)Cu Pitsch关系，如先前报道的那样。此外，界面和表面粗糙度之间存在普遍的相关性，表明初始界面特征在生长过程中传播到整个薄膜。
We have examined bilayer Co/Cu, Fe/Cu, and Ni/Cu films deposited by molecular‐beam epitaxy on hydrogen‐terminated [100] silicon substrates. The magnetic metal/copper interface was examined by atomic resolution transmission electron microscopy and compared with the surface morphology as depicted by atomic force microscopy. The general orientation relationships across the magnetic metal/copper interfaces were found to be: [001]Co, Ni∥[001]Cu; (010)Co, Ni∥(010)Cu and [001]Fe∥[001]Cu; (110)Fe∥(200)Cu. The latter system is equivalent to the [11 1]Fe∥[011]Cu and (110)Fe∥(100)Cu Pitsch relationship, as has been reported earlier. Furthermore, there was a general correlation between interfacial and surface roughness, indicating that the initial interface character is propagated throughout the film during growth.