Microstructures and Thermal Properties of Cold-Sprayed Cu-Cr Composite Coatings
Microstructures and Thermal Properties of Cold-Sprayed Cu-Cr Composite Coatings
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DOI：
10.1007/s11666-013-9926-7
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发表时间：
2013-04
影响因子：
3.1
通讯作者：
S. Kikuchi;S. Yoshino;M. Yamada;M. Fukumoto;K. Okamoto
中科院分区：
文献类型：
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作者：
S. Kikuchi;S. Yoshino;M. Yamada;M. Fukumoto;K. Okamoto
采用冷喷涂工艺制备了导热元件用铜基复合材料，并对原料粉末在铜基上的沉积效率和结合形态进行了评价。采用质量分数为20、35、50、65%铬的铜铬混合粉末，以氮气为载气，在无氧铜衬底上制备了铜基复合材料。研究了铜铬复合涂层的铬含量比、组织结构和导热性能。由于硬质颗粒成形性较差，涂层中的铬含量比约为原料配比的50~60%。透射电子显微镜分析表明，在铬颗粒/铜衬底界面处存在富氧层，这有助于铬颗粒的沉积。1093℃热处理后，涂层的横截面组织较热处理前致密，铜基再结晶改善了涂层的导热性能。
Copper-based composites for thermal conductive components were prepared via the cold spray process, and the deposition efficiency and adhesion morphology of feedstock powders on Cu substrate were evaluated. Cu-based composites were fabricated using Cu-Cr mixed powders with their mixture ratio of 20, 35, 50, and 65 mass% Cr onto oxygen-free copper substrate with N2carrier gas. Cu-Cr composite coatings were investigated for their Cr content ratio, microstructures, and thermal conductivity. The Cr content ratio in the coating was approximately 50-60% of feedstock mixture ratio due to the low formability of the hard particles. Transmission electron microscopy characterizations revealed that an oxygen-rich layer exists at the Cr particle/Cu substrate interface, which contributes to the deposition of the Cr particles. After the heat treatment at 1093 K, the coatings showed denser cross-sectional structures than those before the heat treatment, and the thermal conductivity was improved as a result of the recrystallization of Cu matrix.