The electrodeposition of silver composites using deep eutectic solvents
The electrodeposition of silver composites using deep eutectic solvents
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DOI：
10.1039/c2cp23712a
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发表时间：
2012-01-01
影响因子：
3.3
通讯作者：
Weston, David
中科院分区：
文献类型：
--
作者：
Abbott, Andrew P.;El Ttaib, Khalid;Weston, David
银是电子连接器的重要金属，然而，它非常柔软，磨损可能是一个重大问题。本文叙述了如何从氯化银在乙二醇/氯化胆碱基深Eu 3+溶剂中的溶液中电解沉积银来获得改进的耐磨银涂层。通过掺入SiC或Al 2 O3颗粒观察到磨损体积减少多达10倍。这项工作还解决了在溶液中使用EXAFS探测溶液结构的银氯化物的形态的基本方面。复合颗粒的尺寸而不是性质被认为改变了银存款的形态和晶粒尺寸。晶粒尺寸与以前的成核研究是一致的。LiF的加入显著影响了存款层的形貌，提高了镀层的耐磨性。
Silver is an important metal for electronic connectors, however, it is extremely soft and wear can be a significant issue. This paper describes how improved wear resistant silver coatings can be obtained from the electrolytic deposition of silver from a solution of AgCl in an ethylene glycol/choline chloride based Deep Eutectic Solvent. An up to 10-fold decrease in the wear volume is observed by the incorporation of SiC or Al2O3 particles. The work also addresses the fundamental aspect of speciation of silver chloride in solution using EXAFS to probe solution structure. The size but not the nature of the composite particles is seen to change the morphology and grain size of the silver deposit. Grain sizes are shown to be consistent with previous nucleation studies. The addition of LiF is found to significantly affect the deposit morphology and improve wear resistance.