Formation Process of a Rhenium-Based Diffusion Barrier on a Nickel-Based Superalloy

Formation Process of a Rhenium-Based Diffusion Barrier on a Nickel-Based Superalloy
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镍基高温合金上铼基扩散势垒的形成过程

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发表时间:
2006
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影响因子:
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通讯作者:
T. Narita
T. Narita
中科院分区:
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文献类型:
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作者:
Yongming Wang;S. Ohnuki;T. Narita

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本文研究了镍基高温合金上铼基扩散阻挡涂层的形成过程。扩散阻挡层可以通过电镀和Cr渗碳两个步骤形成。采用电解电镀方法在镍基单晶高温合金基体上制备了由Ni/Re~63Ni~37/Ni组成的三层薄膜结构,通过X射线衍射(XRD)分析发现,Re-Ni镀层薄膜为非晶态合金。采用扫描电子显微镜(SEM)和电子探针显微分析仪(EPMA)研究了Cr-Pack在1573 K下分别渗碳20 min、50 min、240 min、360 min和600 min形成的阻挡膜的变化。阻挡膜厚度的变化呈现出两个阶段,阻挡膜的成分沿着Ni在Re-Ni-Cr σ相中的溶解度极限曲线变化。
The formation process of Rhenium-based diffusion barrier coating on Nickel-based superalloy has been investigated in present paper. The diffusion barrier can be formed by two steps, electroplating and Cr cementation. A tri-layer film structure consisting of Ni / Re~63Ni~37 / Ni was prepared by electrolytic plating onto the substrate of a Ni-based single-crystal superalloy, it was found that the Re-Ni plating film composed of amorphous alloy which is characterized by X-ray diffraction (XRD) analysis. The changes of the barrier films which formed by followed Cr-Pack cementations at 1573 K for 20 min, 50 min, 240 min, 360 min and 600 min, respectively, were investigated by Scan Electron Microscope (SEM) and Electron Probe Micro Analyzer (EPMA). Changing in the thickness of barrier film exhibited two stages, and the composition of barrier film changed along the curve of solubility limit of Ni in Re-Ni-Cr sigma phase.