A bulk of uniform nanocrystalline copper with superior comprehensive mechanical properties electroformed in an ultra-low sulfate concentration bath without additives
A bulk of uniform nanocrystalline copper with superior comprehensive mechanical properties electroformed in an ultra-low sulfate concentration bath without additives
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在无添加剂的超低硫酸盐浓度浴中电铸出具有优异综合机械性能的均匀纳米晶铜块
DOI:
10.1016/j.msea.2017.08.031
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发表时间:
2017-09
期刊:
影响因子:
6.4
通讯作者:
Zhu D.
中科院分区:
文献类型:
--
作者:
Shen C. J.;Zhu Z. W.;Zhu D.
Nanocrystalline copper has a high potential to meet high application requirement of a variety of new industries.for its unique mechanical, physical and chemical properties. But its disappointingly low ductility limits its application. This paper provides a reliable and economical preparation method of nanocrystalline copper with.superior comprehensive mechanical properties. In an ultra-low sulfate concentration bath (20 g/L) without.additives, by strong electrolyte flushing and regulating cathodic working current density from 1 to 6 A/dm2,.copper deposits with different nanostructure is electroformed because of high electrochemical polarization. The.microstructure and mechanical properties of copper deposits are investigated. Except of the deposits of 6 A/dm2,.the copper deposits exhibit good comprehensive mechanical properties in tensile tests at room temperature. In.particular, a bulk of nanocrystalline copper obtained at 4 A/dm2, with uniform grains size (60–70 nm) and.random grain orientation, exhibits superior comprehensive mechanical properties, with a high tensile strength of.526 MPa and a high elongation of 30%. The deformation mechanisms of copper deposits are discussed. Fracture.observation indicates a feature of ductile fracture.
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DOI:
10.4028/www.scientific.net/jmnm.23.183
发表时间:
2005-01
期刊:
Journal of Metastable and Nanocrystalline Materials
影响因子:
--
作者:
S. Bansal;A. Saxena;T. Hartwig;R. Tummala
通讯作者:
S. Bansal;A. Saxena;T. Hartwig;R. Tummala
影响因子:
2.4
作者:
R. Dube;A. Tewari
通讯作者:
R. Dube;A. Tewari
影响因子:
56.9
作者:
Shan, ZW;Stach, EA;Mao, SX
通讯作者:
Mao, SX
影响因子:
9.4
作者:
C. Motz;T. Schöberl;R. Pippan
通讯作者:
C. Motz;T. Schöberl;R. Pippan
影响因子:
3.3
作者:
Ying Wang;Jianqiu Zhou;Jianqiu Zhou;T. Shen;D. Hui;Shenmin Zhang
通讯作者:
Ying Wang;Jianqiu Zhou;Jianqiu Zhou;T. Shen;D. Hui;Shenmin Zhang