Growth and properties of hard coatings prepared by physical vapor deposition methods
Growth and properties of hard coatings prepared by physical vapor deposition methods
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DOI：
10.1016/s0257-8972(09)90064-0
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发表时间：
1992-11
影响因子：
5.4
通讯作者：
S. Kadlec;J. Musil;J. Vyskočil
中科院分区：
文献类型：
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作者：
S. Kadlec;J. Musil;J. Vyskočil
物理气相沉积（PVD）方法已广泛应用于硬质涂层的沉积。为了比较PVD方法的潜力和局限性，有必要充分了解薄膜生长的物理过程、各种薄膜微结构的形成以及由此产生的性能。本文综述了物理薄膜生长参数对薄膜微结构影响的最新研究进展。给出了溅射TiN薄膜微结构的实例。对结构区模型进行了评述。蒸汽和离子通量的均匀性的重要性也进行了讨论，并举例说明。对膜厚和性能的均匀性问题进行了讨论。强调了对表面预处理的要求。
Physical vapor deposition (PVD) methods have found widespread application in the deposition of hard coatings. In order to compare potentials and limitations of the PVD methods, a good knowledge of the physical processes of film growth, formation of various film microstructures, and the resulting properties is necessary. Here the latest advances in understanding the effects of physical film growth parameters on the microstructure of growing films are reviewed. Examples of sputtered TiN film microstructures are given. A critical review of the structure zone models is presented. The importance of the homogeneity of both vapor and ion fluxes is also discussed and illustrated with examples. The problems of uniformity of both the film thickness and properties are also discussed. The requirements imposed on surface pretreatment are highlighted.