Silver assisted crack healing in SiC
Silver assisted crack healing in SiC
复制标题
DOI：
10.1016/j.actamat.2015.11.052
复制
发表时间：
2016-02
期刊：
影响因子：
9.4
通讯作者：
Xin Geng;Fan Yang;Yiqiang Chen;Xiaoxiao Lu;X. Zhong;P. Xiao
中科院分区：
文献类型：
--
作者：
Xin Geng;Fan Yang;Yiqiang Chen;Xiaoxiao Lu;X. Zhong;P. Xiao
本文提出了一种通过溶解-析出机制实现SiC在1450℃真空热处理中裂纹愈合的潜在方法。热力学计算和实验结果证实，Ag与SiC反应形成熔融的Ag - si合金和碳，加速了材料在SiC中的输运，然后Ag - si与碳反应形成新的SiC并填充在裂纹和维氏压痕内，实现了SiC裂纹的愈合。压痕的深度回收率为~ 60%。压痕下的裂纹断裂成一排孤立的结核，这是由于SiC与Ag-Si合金之间的界面能降低所致。
This paper provides a potential method through a dissolution-precipitation mechanism to achieve crack healing in SiC by a vacuum heat treatment with Ag at 1450 °C. The thermodynamic calculations and experimental results confirm that the Ag reacts with SiC to form a molten Ag–Si alloy and carbon, which accelerates material transport in SiC, and then by reaction between the Ag–Si and carbon, a new SiC is formed and fills inside the cracks and Vickers indentation impressions to achieve crack healing in SiC. The depth recovery ratio of the indentation is ∼60%. The cracks underneath the indentation break into a row of isolated nodules, which is driven by reducing the interfacial energy between SiC and the Ag–Si alloy.