Wafer-level Cu-Cu bonding technology
Wafer-level Cu-Cu bonding technology
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DOI：
10.1016/j.microrel.2011.04.016
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发表时间：
2012-02-01
影响因子：
1.6
通讯作者：
Chen, Kuan-Neng
中科院分区：
文献类型：
--
作者：
Tang, Ya-Sheng;Chang, Yao-Jen;Chen, Kuan-Neng
Semiconductor industry currently utilizes copper wafer bonding as one of key technologies for 3D integration. This review paper describes both science and technology of copper wafer bonding with regard to present applications. The classification of Cu bonding, bonding mechanisms, process developments, its microstructure evolution, as well as other characterizations are reviewed. Researches about patterned Cu bonding, future prospects, and 3D integration using Cu bonding are discussed in this paper. (C) 2011 Elsevier Ltd. All rights reserved.
