1D π-d Conjugated Coordination Polymers for Multilevel Memory of Long-Term and High-Temperature Stability
1D π-d Conjugated Coordination Polymers for Multilevel Memory of Long-Term and High-Temperature Stability
复制标题
用于长期和高温稳定性多级记忆的一维 pi-d 共轭配位聚合物
DOI：
10.1002/aelm.201700107
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发表时间：
2017-08-01
影响因子：
6.2
通讯作者：
Lu, Jian-Mei
中科院分区：
文献类型：
--
作者：
Cheng, Xue-Feng;Shi, Er-Bo;Lu, Jian-Mei
利用Ni(II)盐与苯四胺或3，3‘，4，4’-联苯基四胺在溶液中配位合成了一维d-pi共轭配位聚合物链，制备了三元电阻随机存储器(RRAM)器件。所制作的器件在室温下可以保持其存储状态长达3个月，或者在150℃下至少工作10000 S，这是在撰写本文时报道的三值RRAM的最高工作温度。热重分析表明，这两种材料具有良好的结晶性和较强的分子间相互作用，具有良好的热稳定性。一维共轭配位聚合物的长期稳定性和高温稳定性使其有望成为通过RRAM技术实现高密度数据存储的新一代材料。
Ternary resistive random access memory (RRAM) devices are fabricated from 1D d-pi conjugated coordination polymer chains, which are synthesized via the coordination between Ni(II) salts and benzenetetramine or 3,3', 4,4'-biphenyltetramine in a solution process. The as-fabricated devices can retain their memory states for as long as three months at room temperature or work for at least 10 000 s at 150 degrees C, which is the highest working temperature reported for a ternary RRAM at the time of writing this paper. Thermogravimetric analysis indicates good thermal stability of these two materials because of their good crystallinity and strong intermolecular interaction. The long-term and high-temperature stability makes 1D conjugated coordination polymer chains a promising candidate for use as next-generation material for highdensity data storage via RRAM techniques.