Full Densification of Loosely Packed W–Cu Composite Powders
Full Densification of Loosely Packed W–Cu Composite Powders
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DOI：
10.1179/pom.1998.41.1.51
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发表时间：
1998-01
影响因子：
1.4
通讯作者：
I. Moon;E. Kim;G. Petzow
中科院分区：
文献类型：
--
作者：
I. Moon;E. Kim;G. Petzow
金属注射成型（MIM）技术似乎有潜力大规模生产的小，形状精致的W-Cu零件，主要用于微电子，虽然在致密化的问题，由于固有的烧结性差的W-Cu系统，以及低体积分数的MIM脱粘部分，需要克服。为了使松散堆积的钨铜复合粉末在MIM棕制件中完全致密化，进行了几次尝试。使用纳米复合W-Cu粉末，无论是由细W和Cu氧化物粉末的共还原或通过W和Cu粉末的机械合金化制备，被证明是提高烧结性，导致在完全致密化的W-Cu MIM零件。在具有高混合均匀性和堆积密度的定制W-Cu粉末混合物的情况下观察到类似的效果。相关W-Cu系统的高烧结性部分归因于纳米烧结效应，由于W-Cu相的内在均匀和精细混合状态，部分归因于活化烧结，这是由大量研磨过程中引入的杂质促进的。PM/0768
The metal injection moulding (MIM) technique appears to have potential for mass production of small and delicately shaped W–Cu parts, primarily for microelectronics, although problems in densification, owing to the inherently poor sinterability of the W–Cu system as well as the low volume fraction of MIM debound parts, need to be overcome. Several attempts have been made to attain full densification of the loosely packed W–Cu composite powders in MIM brown parts. The use of the nanocomposite W–Cu powders, prepared either by coreduction of fine Wand Cu oxide powder or by mechanical alloying of Wand Cu powders, was shown to enhance the sinterability, resulting in the full densification of W–Cu MIM parts. Similar effects were observed in the case of tailored W–Cu powder mixtures with high mixing homogeneity and packing density. The high sinterability of the pertinent W–Cu systems is attributed partly to the nanosintering effect, owing to the intrinsic homogeneous and fine mixed state of the W–Cu phases, and partly to activated sintering which is promoted by impurities introduced during the extensive milling process. PM/0768