The effect of mechanical–physical pretreatment on hydrometallurgical extraction of copper and tin in residue from printed circuit boards from used consumer equipment
The effect of mechanical–physical pretreatment on hydrometallurgical extraction of copper and tin in residue from printed circuit boards from used consumer equipment
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DOI：
10.1016/j.mineng.2014.06.004
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发表时间：
2014-10
影响因子：
4.8
通讯作者：
T. Havlík;D. Oráč;Mattias Berwanger;Anja Maul
中科院分区：
文献类型：
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作者：
T. Havlík;D. Oráč;Mattias Berwanger;Anja Maul
本工作主要研究废旧消费设备中印刷电路板的机械-物理预处理，然后用盐酸溶液浸取渣油中的铜和锡。机械-物理前处理分三种不同的程序实现。关键工艺分别为电动力分离、错流空气筛分离和气床分离。在80℃、1M和2M HCl中进行了浸出试验。结果表明，错流气流过筛可使渣分中有色金属的积累量最大。从该馏分中，锡的萃取率最高，铜的萃取率最低。
This work is focused on studying mechanical–physical pretreatment of printed circuit boards from used consumer equipment followed by extraction of copper and tin from residue fractions by leaching in hydrochloric acid solutions. Mechanical–physical pretreatment was realized in three different procedures. Key processes were electro-dynamic separation, cross-flow air sifter separation and air table separation, respectively. Leaching experiments were carried out in 1 M and 2 M HCl at 80 °C. The results show that cross-flow air sifting leads to the highest accumulation of non-ferrous metals in a residue fraction. From this fraction, the highest extraction of tin with minimal copper extraction was achieved.