Development of atomic layer deposition-activated microchannel plates for single particle detection at cryogenic temperatures

Development of atomic layer deposition-activated microchannel plates for single particle detection at cryogenic temperatures
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DOI:
10.1116/1.4862947
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发表时间:
2014-03-01
影响因子:
2.9
通讯作者:
Tremsin, Anton S.
Tremsin, Anton S.
中科院分区:
材料科学2区
文献类型:
--
作者:
Gorelikov, Dmitry;Sullivan, Neal;Tremsin, Anton S.

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原子层沉积(ALD)技术用于纳米工程微通道板(MCP)电子倍增器孔隙内的功能膜,使新型MCP制造技术大大提高了性能并开辟了新的应用领域。作者已经开发了定制的工具和配方来生长保形膜,通过ALD优化了非常长的通道内的电导和二次电子发射(类似于6-20 μ m直径和bbb600 μ m长度,每个MCP有数千万个通道)。这些ALD薄膜独特的特性调整能力使其能够在极端条件下进行时间分辨单粒子成像的应用,例如在低温下的高计数率。实验证实了导电和发射纳米膜在20 μ m孔MCP玻璃基板上的粘附性,以及它们在10-700 K的很宽温度范围内的机械稳定性。在多次冷却循环中,ALD MCPs的抗性是可重复的,没有观察到膜降解。优化新型mcp在低温下工作的电阻,可以在低于20 K的温度下实现高计数率的事件检测。(C) 2014年美国真空学会。
Atomic layer deposition (ALD) technology is used to nanoengineer functional films inside the pores of microchannel plate (MCP) electron multipliers, enabling a novel MCP manufacturing technology that substantially improves performance and opens novel applications. The authors have developed custom tools and recipes for the growth of conformal films, with optimized conductance and secondary electron emission inside very long channels (similar to 6-20 mu m diameter and >600 mu m length, with tens of millions of channels per single MCP) by ALD. The unique ability to tune the characteristics of these ALD films enables their optimization to applications where time-resolved single particle imaging can be performed in extreme conditions, such as high counting rates at cryogenic temperatures. Adhesion of the conductive and emissive nanofilms to the 20 mu m pore MCP glass substrates and their mechanical stability over a very wide range of temperatures (10-700 K) were confirmed experimentally. Resistance of ALD MCPs was reproducible during multiple cool-down cycles with no film degradation observed. Optimizing resistance of novel MCPs for operation at cryogenic temperature should enable high count rate event detection at temperatures below 20 K. (C) 2014 American Vacuum Society.