Structural and electronic characterization of Cu/Au(111) near-surface alloys
Structural and electronic characterization of Cu/Au(111) near-surface alloys
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DOI：
10.7567/1347-4065/ab1b5b
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发表时间：
2019-06
影响因子：
1.5
通讯作者：
F. Grillo;R. Megginson;D. Batchelor;M. Muntwiler;C. Baddeley
中科院分区：
文献类型：
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作者：
F. Grillo;R. Megginson;D. Batchelor;M. Muntwiler;C. Baddeley
一种金属在另一种金属上的双金属薄膜的几何结构和电子特性受到晶格失配和近表面合金形成等因素的强烈影响。掺杂的系统通常显示出改性的化学物理性质，这可能适用于不同的反应途径。铜-金表面合金已经受到了一些研究的关注，其中只有少数是在超高真空环境中使用表面敏感技术进行的。本文利用扫描隧道显微镜和同步辐射技术（X射线光电子衍射、光电子能谱）研究了在（22 × 103）-Au（111）表面室温沉积铜，在不同铜含量和不同退火温度下产生的系统，并与一些理论模型进行了比较。总的来说，在制备过程中基本上保持了fcc晶格。在热处理后，结构和成分的变化，有利于合金结构与tetraorthane包装，被视为。
Geometrical structure and electronic characteristics of ultrathin metallic films of one metal on another are strongly influenced by factors such as lattice mismatch and formation of near-surface alloys. Doped systems often show modified chemico-physical properties which may be amenable to different reactivity routes. Copper–gold surface alloys have received the attention of several studies, only a few of which have been undertaken in an ultra-high vacuum environment, using surface sensitive techniques. In this contribution, systems produced upon room temperature deposition of copper on the (22 × √3)-Au(111) surface, at various copper loadings and annealed to different temperatures, are investigated using scanning tunneling microscopy and synchrotron radiation based techniques (X-ray photoelectron diffraction, photoemission), with comparison with some theoretical modeling. Overall the fcc lattice is essentially maintained on preparation. Upon thermal treatments structural and compositional changes, in favor of alloyed structures with tetragonal packing, are seen.