Plasma particulate contamination control. I: Transport and process effects
Plasma particulate contamination control. I: Transport and process effects
复制标题
等离子体颗粒物污染控制。
DOI：
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发表时间：
1991
期刊：
影响因子：
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通讯作者：
G. Selwyn
中科院分区：
文献类型：
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作者：
G. Selwyn
利用激光光散射和视频检测相结合的方法，实时成像等离子体处理过程中颗粒的传输和行为。结果表明，颗粒的分布具有高度的有序性和可预测性。两种效应对颗粒的分布和位置有很大的影响：进气阻力和静电陷阱。粒子陷阱是由等离子体扰动以及电极和工具的设计特性形成的。这些结果在微电子制造中使用的正常等离子体条件下得到了证实。提出了一种控制等离子体污染的策略。完全消除诱捕效应是不可行的。取而代之的是，工艺技术被用来最小化或消除陷阱的吸引力。文中还讨论了几个例子。
The transport and behavior of particulates during plasma processing is imaged in real time using rastered laser light scattering combined with video detection. Results show the distribution of particles is highly ordered and predictable. Two effects have major influence on the distribution and location of particles: feed gas drag and electrostatic traps. Particle traps form from plasma disturbances and design properties of the electrode and the tooling. These results are confirmed in normal plasma conditions used in microelectronics fabrication. A strategy is presented for plasma contamination control. Complete elimination of trapping effects is not feasible. Instead, process techniques are used to minimize or defeat the attractive nature of the traps. Several examples are discussed.