Laser-Assisted Sintering of Silver Nanoparticle Paste for Bonding of Silicon to DBC for High-Temperature Electronics Packaging
Laser-Assisted Sintering of Silver Nanoparticle Paste for Bonding of Silicon to DBC for High-Temperature Electronics Packaging
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DOI：
10.1109/tcpmt.2020.3046917
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发表时间：
2021-03
期刊：
影响因子：
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通讯作者：
G. D. Liu;Changhai Wang;J. Swingler
中科院分区：
文献类型：
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作者：
G. D. Liu;Changhai Wang;J. Swingler
本文提出了一种激光辅助烧结方法的银纳米粒子膏的键合的硅芯片的直接键合铜（DBC）基板的高温电子封装应用的发展。研究了激光功率、键合压力、键合时间等键合参数对剪切强度的影响。为了比较，还生产和研究了使用热板粘合的样品。在可靠性研究中进行了抗剪强度、截面和断裂面分析。结果表明，在键合压力为3 MPa、激光功率为70 W、辐照时间为1 min的条件下，可以获得10 MPa的剪切强度，当辐照时间增加到5 min时，剪切强度达到20 MPa。并因此影响烧结温度和照射时间。与需要数十分钟的烧结时间的基于热板的方法相比，具有5分钟的短照射时间的激光辅助方法可以产生相同水平的剪切强度。激光辅助烧结技术具有快速、局部化加热的特点，可以提高高温电子器件和传感器封装的制造效率。
This article presents the development of a laser-assisted sintering method of a silver nanoparticle paste for bonding of a silicon chip to a direct bonded copper (DBC) substrate for high-temperature electronics packaging applications. The effects of the bonding parameters such as laser power, bonding pressure, and time on shear strength were studied. For comparison, samples using hotplate bonding were also produced and studied. Shear strength, cross section, and fracture surface analysis were carried out in reliability studies. The results show that shear strength of 10 MPa can be achieved at the bonding pressure of 3 MPa, laser power of 70 W, and a very short irradiation time of 1 min. The shear strength reached 20 MPa when the irradiation time was increased to 5 min. The research indicates that the shear strength can be improved by increasing the bonding pressure, laser power, and hence the sintering temperature and the irradiation time. The laser-assisted method with a short irradiation time of 5 min can produce the same level of shear strength as compared with the hotplate-based approach requiring a sintering time of tens of minutes. With the ability of fast and localized heating effect, the laser-assisted sintering method can improve the manufacturing efficiency for packaging of high-temperature electronics and sensors.