Large-area 1D selective emitter for thermophotovoltaic applications in the mid-infrared

Large-area 1D selective emitter for thermophotovoltaic applications in the mid-infrared
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DOI:
10.1116/6.0002198
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发表时间:
2023-01
期刊:
Journal of Vacuum Science & Technology B
影响因子:
--
通讯作者:
M. Oh;Kevin A. Grossklaus;T. Vandervelde
M. Oh;Kevin A. Grossklaus;T. Vandervelde
中科院分区:
其他
文献类型:
--
作者:
M. Oh;Kevin A. Grossklaus;T. Vandervelde

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二维或三维图案化的亚波长结构,也称为超材料,具有可任意设计的光学特性的优点。在热光伏 (TPV) 应用中,超材料通常用于针对各种源温度优化发射器的辐射光谱。 TPV 器件的输出功率与光子通量成正比,而光子通量又与发射器尺寸成正比。然而,使用 2D 或 3D 超材料给实现大型发射器带来了挑战,因为制造其亚波长特征通常涉及复杂的制造工艺并且非常耗时。在这项工作中,我们展示了一个大面积(78 cm2)热发射器。该发射器仅由一维硅 (Si) 和铬 (Cr) 层制成,因此可以轻松放大到更大的尺寸。发射器的发射率光谱在 802 K 下测量,目标是中红外发射峰。发射率峰值在 3.75 μm 波长处为 ∼0.84,带宽为 1.2 μm。此外,我们的发射器的发射光谱可以通过改变硅的厚度来适应不同的源温度。因此,这项工作的结果可以使 TPV 应用具有更高的输出功率和更低的制造成本。
Two- or three-dimensionally patterned subwavelength structures, also known as metamaterials, have the advantage of arbitrarily engineerable optical properties. In thermophotovoltaic (TPV) applications, metamaterials are commonly used to optimize the emitter’s radiation spectrum for various source temperatures. The output power of a TPV device is proportional to the photon flux, which is proportional to the emitter size. However, using 2D or 3D metamaterials imposes challenges to realizing large emitters since fabricating their subwavelength features typically involves complicated fabrication processes and is highly time-consuming. In this work, we demonstrate a large-area (78 cm2) thermal emitter. This emitter is simply fabricated with one-dimensional layers of silicon (Si) and chromium (Cr), and therefore, it can be easily scaled up to even larger sizes. The emissivity spectrum of the emitter is measured at 802 K, targeting an emission peak in the mid-infrared. The emissivity peak is ∼0.84 at the wavelength of 3.75 μm with a 1.2 μm bandwidth. Moreover, the emission spectrum of our emitter can be tailored for various source temperatures by changing the Si thickness. Therefore, the results of this work can lead to enabling TPV applications with higher output power and lower fabrication cost.