Influence of Surface Removing on Microfracture Strength of Ceramics as Evaluated Using a Spherical Indenter.
Influence of Surface Removing on Microfracture Strength of Ceramics as Evaluated Using a Spherical Indenter.
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使用球形压头评估表面去除对陶瓷微断裂强度的影响。
DOI：
10.1299/kikaia.60.1773
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发表时间：
1994
期刊：
影响因子：
--
通讯作者：
Kohji Ohgushi
中科院分区：
文献类型：
--
作者：
M. Ichikawa;Kohji Ohgushi
研究了表面去除对结构陶瓷表面层微断裂强度的影响，用球形压痕试验评价了表面去除对结构陶瓷表面层微断裂强度的影响，其中微断裂强度定义为环形裂纹萌生时的最大拉伸应力。使用Si3N4球形压头在抛光的Si3N4板上进行压痕测试。还进行了常规弯曲试验。与未抛光试样一样，微断裂强度的分散性远小于弯曲断裂强度的分散性。因此，表面去除并没有改变我们以前的发现，微断裂强度不能相关的弯曲断裂强度的概念的基础上的有效面积。提出了一种基于断裂力学的观点来联系这两种强度。
An investigation was made concerning the influence of surface removing on the microfracture strength of the surface layer of structural ceramics as evaluated by sphere indentation tests, where the microfracture strength was defined as the maximum tensile stress at ring crack initiation. Indentation tests were carried out on polished Si3N4 plates using a Si3N4 spherical indenter. Conventional bending tests were also conducted. As in unpolished specimens, the scatter of the microfracture strength was found to be much smaller than that of the bending fracture strength. Thus, surface removing does not alter our previous finding that the microfracture strength can not be related to the bending fracture strength based on the concept of effective area. An idea based on fracture mechanics was suggested to relate the two kinds of strength.