Adhesion of micrometer-sized polymer particles under a scanning electron microscope
Adhesion of micrometer-sized polymer particles under a scanning electron microscope
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DOI：
10.1063/1.1288006
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发表时间：
2000-09-15
影响因子：
3.2
通讯作者：
Shinya, N
中科院分区：
文献类型：
--
作者：
Miyazaki, HT;Tomizawa, Y;Shinya, N
在扫描电子显微镜（SEM）下操纵微米大小的物体并将其组装成微观结构的技术对于微尺度物理学的研究非常重要。已经证明，从亚μ m到几个10 μ m的微物体可以通过将它们粘附在探针的尖端来自由地操纵。然而，目前在扫描电镜下的微操作技术仍然是低效的，因为人们对微观物体在扫描电镜环境下的粘附机制知之甚少。在这项研究中，微米大小的聚合物颗粒沉积在衬底上的附着力在扫描电镜观察期间被直接测量。研究发现，在Au衬底上沉积半径为1 μ m的聚乙烯烯球与涂有Au的半球形玻璃探针之间的附着力表现出各种复杂的行为。观察到电子束辐照引起的附着力不可逆增大，且附着力与电子通量和探针电压有关。另一方面，传统理论预测的与压力和探针直径的关系没有得到证实。采用基于电子辐射在接触界面形成双电层和蠕变的连续过程的模型成功地解释了这一观察到的复杂现象。(C) 2000年美国物理研究所。[s0021 - 8979(00) 01618 - 2]。
Techniques for manipulating micrometer-sized objects and assembling them into a microstructure in a scanning electron microscope (SEM) are important for research related to microscale physics. It has been demonstrated that micro-objects ranging from sub-mu m to several 10 mu m can be freely manipulated by adhering them to the tip of a probe. However, the present micromanipulation technique in a SEM is still inefficient, because little is known about the adhesion mechanisms of micro-objects in a SEM environment. In this study, the adhesion forces of micrometer-sized polymer particles deposited on a substrate during SEM observation have been directly measured. The adhesion forces between a polyvinyltoluene sphere of 1 mu m radius deposited on a Au substrate, and a glass probe with a hemispherical tip with a typical radius of 0.75 mu m coated with Au, were found to show various complicated behaviors. An irreversible increase in the adhesion forces initiated by the electron-beam (EB) irradiation, and the dependence of the adhesion on the electron flux and the probe voltage were observed. On the other hand, the dependence on the pressing force and the probe diameter, predicted by a conventional theory, was not confirmed. This observed complicated phenomena were successfully explained using the model based on the formation of an electric double layer at the contact interface by the EB irradiation, and the successive progress of creep deformation. (C) 2000 American Institute of Physics. [S0021-8979(00)01618-2].