Selective laser sintering of Ag nanoparticles ink for applications in flexible electronics
Selective laser sintering of Ag nanoparticles ink for applications in flexible electronics
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DOI：
10.1016/j.apsusc.2014.10.120
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发表时间：
2015-05-01
影响因子：
6.7
通讯作者：
Zergioti, I.
中科院分区：
文献类型：
--
作者：
Theodorakos, I.;Zacharatos, F.;Zergioti, I.
在本研究中，研究了在 532 和 1064 nm 下工作的三种不同激光源（连续波 (cw) 或脉冲纳秒 (ns) 和皮秒 (ps)）作为在柔性基材上选择性激光烧结银纳米颗粒 (NP) 墨水层的有效工具的潜力。理论模拟表明，皮秒 (ps) 激光脉冲将热影响区域限制在墨水层照射区域周围的几微米内。对于较长持续时间的脉冲或连续波操作，必须考虑激光束轮廓和平均功率，以避免不期望的高温到达基板。这些预测在 1064 nm 和 ps 脉冲下得到了实验证实，实现了高效的银墨水烧结，且没有基材降解的迹象。相反，较长的脉冲可能会在较宽的波长范围内烧结银纳米颗粒，但会在较宽的激光注量范围内造成基底损坏。当施加高于 20W 的激光功率时，连续波模式可能会对低 Tg 聚合物造成损坏，但它是烧结均质金属特征微图案的最灵活的工具。讨论了每种配置的特征和基本机制。 (C) 2014 年由 Elsevier B.V. 出版
In this study the potential of three different laser sources (continuous wave (cw) or pulsed nanosecond (ns) and picosecond (ps)) operating at 532 and 1064 nm is investigated, as efficient tools for selective laser sintering of Ag nanoparticle (NP) ink layers on flexible substrates. Theoretical simulations indicate that picosecond (ps) laser pulses restrict the heat affected zone to a few micrometers only around the irradiated regions of the ink layer. For longer duration pulses or continuous wave operation, the laser beam profile and average power must be taken into account in order to avoid undesirably high temperatures reaching the substrate. These predictions were confirmed experimentally at 1064 nm and with ps pulses, efficient Ag ink sintering was achieved with no evidence of substrate degradation. On the contrary longer pulses may sinter Ag NPs in a broad wavelength range but inflict substrate damage over a wide laser fluence regime. Continuous wave mode may inflict damage to the low Tg polymers when applying laser power higher than 20W, but it is the most flexible tool for sintering micro-patterns of homogeneous metallic features. The characteristics and the underlying mechanisms of each configuration are discussed. (C) 2014 Published by Elsevier B.V.