Electromigration characteristics of CuAl2
Electromigration characteristics of CuAl2
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CuAl2的电迁移特性
DOI：
10.1016/j.jallcom.2022.165615
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发表时间：
2022
影响因子：
6.2
通讯作者：
and J. Koike
中科院分区：
文献类型：
--
作者：
T. Kuge;M. Yahagi;and J. Koike
具有良好热稳定性和低电阻率的金属间化合物作为先进电子器件中的互连材料开辟了一个新的应用领域;然而，其在工作条件下的可靠性仍然未知。本文以Cu纯金属为研究对象，重点研究了CuAl 2金属间化合物及其电迁移可靠性。研究了与电磁相关的特征参数和机制，包括微结构损伤、漂移速度、激活能、临界长度和寿命。结果表明，与传统的Cu互连材料相比，CuAl 2具有上级的电磁可靠性。
Intermetallic compounds with good thermal stability and low electrical resistivity have opened up a new field of application as interconnect materials in advanced electronic devices; however, its reliability under operating conditions remains unknown. This study focuses on CuAl2intermetallic compound and its electromigration (EM) reliability with reference to the results of Cu pure metal. Characteristic parameters and mechanisms related to EM are investigated, including microstructure damage, drift velocity, activation energy, critical length, and lifetime. The results demonstrate that CuAl2has superior EM reliability compared with the conventional Cu interconnect material.