AN ELECTRONMICROSCOPIC STUDY ON COPPER PRECIPITATION BY COPPER-RESISTANT YEAST CELLS
AN ELECTRONMICROSCOPIC STUDY ON COPPER PRECIPITATION BY COPPER-RESISTANT YEAST CELLS
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DOI：
10.1007/bf01252044
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发表时间：
1963-01-01
期刊：
影响因子：
2.9
通讯作者：
KIKUCHI, T
中科院分区：
文献类型：
--
作者：
ASHIDA, J;HIGASHI, N;KIKUCHI, T
电镜观察表明，在含铜培养基中培养的耐铜酵母细胞的细胞壁中有丰富的铜硫化物沉淀。沉淀的Cu：S比似乎在约1.8至1的范围内。
By electronmicroscopic observation of ultrathin sections, it was revealed that sulfide of copper was precipitated richly in the cell wall of copper-resistant yeast cells cultured in a copper-containing medium. The ratio Cu:S of the precipitation seems to range from about 1.8 to 1.