Development of a fast atom beam gun for surface-activated bonding
Development of a fast atom beam gun for surface-activated bonding
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DOI：
10.1016/j.precisioneng.2019.11.006
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发表时间：
2020-03
影响因子：
3.6
通讯作者：
R. Morisaki;Hirai Yuuki;C. Oka;M. Mizoshiri;T. Yamazaki;J. Sakurai;Takami Hirai;Tomonori Takahashi;H. Tsuji;S. Hata
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文献类型：
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作者：
R. Morisaki;Hirai Yuuki;C. Oka;M. Mizoshiri;T. Yamazaki;J. Sakurai;Takami Hirai;Tomonori Takahashi;H. Tsuji;S. Hata
表面活化键合(SAB)，又称室温键合，用于半导体器件的三维集成技术。用于SAB的Ar快原子束(FAB)。然而，传统的FAB喷枪必须在数百分钟的照射后更换，因为碳磨损粉末是由喷枪中的Ar离子溅射产生的。因此，本研究开发了一种具有更高寿命的新型FAB枪。提出的FAB枪采用磁场来引导Ar离子，以减少枪内的溅射，提高辐照效率。建议的FAB喷枪表明了提高喷枪寿命的可能性。
Surface-activated bonding (SAB), also called room-temperature bonding, is used in three-dimensional integration technology for semiconductor devices. An Ar fast atom beam (FAB) is used for SAB. However, conventional FAB guns must be replaced after hundreds of minutes of irradiation because carbon abrasion powders are generated by Ar ions sputtering in the gun. Therefore, this study develops a novel FAB gun with improved lifetime. The proposed FAB gun applies magnetic fields to guide Ar ions to reduce sputtering in the gun and improve irradiation efficiency. The proposed FAB gun indicates the possibility of improving gun lifetime.