Composition design of Sn-rich Sn-Au-Ag solders using cluster-plus-glue-atom model
Composition design of Sn-rich Sn-Au-Ag solders using cluster-plus-glue-atom model
复制标题
使用簇加胶原子模型进行富锡 Sn-Au-Ag 焊料的成分设计
DOI：
10.1007/s10854-017-6907-5
复制
发表时间：
2017-08-01
影响因子：
2.8
通讯作者：
Yang, Y. C.
中科院分区：
文献类型：
--
作者：
Huang, M. L.;Huang, F. F.;Yang, Y. C.
基于原子团簇加胶原子模型，以[Sn 11 Au 2]Sn-3和[AuSn 8]Au为基本原子团簇结构，设计了新型富Sn Sn-Au-Ag钎料合金。系统研究了所设计的Sn-Au-Ag钎料的微观结构、熔化行为、润湿性和界面反应。基于[Sn 11 Au 2]Sn-3原子簇公式设计的Sn-Au-Ag钎料比基于[AuSn 8]Au原子簇公式设计的钎料具有更好的形成近共晶成分的能力。[Sn 11 Au 1Ag 1]Sn-3和[Sn11Au0.5Ag1.5]Sn-3焊料具有近共晶成分，熔化温度分别为206.89和207.25 A ℃。而基于[AuSn 8]Au团簇公式设计的Sn-Au-Ag焊料为非近共晶。Sn-Au-Ag钎料的显微组织由分散在β-Sn基体中的AuSn 4和Ag 3Sn相组成。Sn-Au-Ag钎料在Ni基片上的润湿性好于Cu基片，[Sn 11 Ag 2]Sn-3在Cu基体上的润湿性优于在Ni基体上。
Novel Sn-rich Sn-Au-Ag solder alloys were designed based on the cluster-plus-glue-atom model and the [Sn11Au2]Sn-3 and [AuSn8]Au were applied as the basic cluster formulas. The microstructure, melting behavior, wettability and the interfacial reaction of the designed Sn-Au-Ag solders were systematically investigated. The Sn-Au-Ag solders designed based on the [Sn11Au2]Sn-3 cluster formula have a better ability to form the near-eutectic composition than those designed based on the [AuSn8]Au cluster formula. The [Sn11Au1Ag1]Sn-3 and [Sn11Au0.5Ag1.5]Sn-3 solders have near-eutectic compositions, with the melting temperatures of 206.89 and 207.25 A degrees C, respectively. While the Sn-Au-Ag solders designed based on the [AuSn8]Au cluster formula are non near-eutectics. The microstructure of the Sn-Au-Ag bulk solders consists of the AuSn4 and Ag3Sn phases dispersed in beta-Sn matrix. The Sn-Au-Ag solders have a better wettability on Ni substrate than on Cu substrate, while the Sn-Ag solder, i.e., [Sn11Ag2]Sn-3 has a better wettability on Cu substrate than on Ni substrate.