The influence of alloying, temperature, and related effects on the stacking fault energy
The influence of alloying, temperature, and related effects on the stacking fault energy
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DOI:
10.1007/bf03038370
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发表时间:
1970-09
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影响因子:
--
通讯作者:
P. Gallagher
中科院分区:
文献类型:
--
作者:
P. Gallagher
The present paper reviews experimental results for the magnitude of the stacking fault energy (γ) in pure fcc metals, and its variation with alloying and with temperature. Quantitative studies have principally involved electron microscopic observations of faulted defects (extended nodes, extrinsic-intrinsic fault pairs, tetrahedra) or the determination of rolling textures, while much valuable information has also been obtained from measurements of the X-ray faulting probability. Extensive measurements of the variation of γ with alloying have been made in silver, copper, and nickel base alloys and in stainless steels, from which general conclusions can be drawn regarding the composition dependence of γ with various solute types. The presence of irregular faulted configurations in samples of some high solute concentration alloys following room temperature deformation suggests that solute/dislocation pinning forces can exert considerable influence on the dislocation substructure. Annealing such samples leads to a reduction in the degree of irregularity of the substructure and generally to a decrease in mean faulted defect size. These changes appear to be due to the reduction, through a thermally activated process, of the effectiveness of the solute pinning forces rather than as a result of a strong dependence of γ on temperature. The variation of faulted defect size on annealing pure materials is likely to arise solely from the variation with temperature of γ and the elastic constants, and results in silver indicate that γ/Gis approximately independent of temperature.