Direct Freeform Laser Fabrication of 3D Conformable Electronics
Direct Freeform Laser Fabrication of 3D Conformable Electronics
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DOI：
10.1002/adfm.202210084
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发表时间：
2022-10
影响因子：
19
通讯作者：
Bujingda Zheng;Ganggang Zhao;Zheng Yan;Yunchao Xie;Jian Lin
中科院分区：
文献类型：
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作者：
Bujingda Zheng;Ganggang Zhao;Zheng Yan;Yunchao Xie;Jian Lin
自由曲面上的3D适形电子设备显示出比传统平面电子设备上级的性能。它们代表了未来电子产品的趋势，并在各种应用中呈指数级增长。然而，它们的潜力在很大程度上受到缺乏复杂制造技术的限制。为了应对这一挑战，报告了一种新的直接自由曲面激光（DFL）制造方法，该方法通过5轴激光加工平台实现，用于在目标任意表面上直接制造3D贴合电子器件。因此，代表性的激光诱导石墨烯（LIG）、金属和金属氧化物被成功地制造为来自不同材料前体的高性能传感和电极材料，其在各种类型的基底上用于温度/光/气体传感、能量存储和用于电路的印刷电路板。最后但并非最不重要的是，为了展示在智能家居中的应用，基于LIG的适形应变传感器被制造并分布在人造树的指定位置。分布式传感器能够在经过良好训练的机器学习模型的帮助下监测风速和风向。这一新工艺将为制造3D适形电子器件铺平新的通用路线，从而在机器人、生物医学传感、结构健康、环境监测和物联网应用中创造新的机会。
3D conformable electronic devices on freeform surfaces show superior performance to the conventional, planar ones. They represent a trend of future electronics and have witnessed exponential growth in various applications. However, their potential is largely limited by a lack of sophisticated fabrication techniques. To tackle this challenge, a new direct freeform laser (DFL) fabrication method enabled by a 5‐axis laser processing platform for directly fabricating 3D conformable electronics on targeted arbitrary surfaces is reported. Accordingly, representative laser‐induced graphene (LIG), metals, and metal oxides are successfully fabricated as high‐performance sensing and electrode materials from different material precursors on various types of substrates for applications in temperature/light/gas sensing, energy storage, and printed circuit board for circuit. Last but not the least, to demonstrate an application in smart homes, LIG‐based conformable strain sensors are fabricated and distributed in designated locations of an artificial tree. The distributed sensors have the capability of monitoring the wind speed and direction with the assistance of well‐trained machine‐learning models. This novel process will pave a new and general route to fabricating 3D conformable electronic devices, thus creating new opportunities in robotics, biomedical sensing, structural health, environmental monitoring, and Internet of Things applications.