Investigation of dealloying in Au-Ag thin films by quantitative electron probe microanalysis
Investigation of dealloying in Au-Ag thin films by quantitative electron probe microanalysis
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DOI：
10.1016/j.scriptamat.2006.12.022
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发表时间：
2007-04
影响因子：
6
通讯作者：
Xubing Lu;E. Bischoff;R. Spolenak;T. Balk
中科院分区：
文献类型：
--
作者：
Xubing Lu;E. Bischoff;R. Spolenak;T. Balk
通过定量电子探针微分析和扫描电子显微镜研究了 Au-Ag 薄膜的脱合金。对于金含量大于 44at.% 的薄膜成分，银的溶解受到限制，各个孔随机分布在表面上。当初始 Au 含量降低到 44at.% 以下时，脱合金性会增强。脱合金阈值或分离极限为 35at.% Au，低于该阈值将形成完全纳米多孔结构。脱合金还会导致薄膜厚度略有减少，这可以使用此处讨论的技术轻松测量。
Dealloying of Au–Ag films has been investigated by quantitative electron probe microanalysis and scanning electron microscopy. For film compositions greater than 44at.% Au, dissolution of Ag is limited, with individual pores distributed randomly on the surface. Dealloying is enhanced as the initial Au content decreases below 44at.%. The dealloying threshold, or parting limit, below which the fully nanoporous structure evolves, is 35at.% Au. Dealloying also causes a slight decrease in film thickness, which is readily measured using the technique discussed here.