Dual-Cure Networks Designed for Property Modulation via High-Energy Radiation

Dual-Cure Networks Designed for Property Modulation via High-Energy Radiation
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双固化网络专为通过高能辐射调节特性而设计

DOI:
10.1021/acsapm.3c00465
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发表时间:
2023
影响因子:
5
通讯作者:
Schmidt, Daniel F.
Schmidt, Daniel F.
中科院分区:
化学2区
文献类型:
--
作者:
Xia, Weiqing;Hurvitz, Samuel B.;Lee, Joshua Y.;Stapleton, Scott E.;Schmidt, Daniel F.

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功能梯度胶粘剂(FGA)是一类特殊的功能梯度材料,其性能可以局部调节,从而能够使沿粘结接头的应力分布沿着更均匀。出于开发具有良好定义和稳定的性质梯度的FGA的需要,提出了一种涉及使用热/电离辐射双固化粘合剂的新方法。为了产生具有双固化特性的粘合剂,已经开发了一系列含有富含不饱和度的反应性液体橡胶基添加剂的环氧树脂配方。将网络热固化,然后进行γ辐照,并通过化学,热和机械表征检查其进行二次交联反应的能力。虽然添加大浓度的液体橡胶添加剂可能导致模量和玻璃化转变温度等性能的初始降低,但它们的添加可以显著提高辐射敏感性,从而能够实现作为辐射剂量函数的性能的大的、良好控制的变化。然后利用一种简便的方法来产生具有硬度梯度的材料,从而证实了这种制剂产生FGA的潜力。此外,这些辐射敏感树脂的行为成功地描述了由Shibayama提出的模型。该模型提供了一个有用的手段来预测辐射诱导交联后的双固化环氧树脂的玻璃化转变温度,并提供了这些网络的分子水平的行为的额外的见解。这一努力突出了这种通用方法的承诺,形成基于仔细的设计和加工系统敏感的热和辐射固化的FGA。
A functionally graded adhesive (FGA) is a specific class of functionally graded material whose properties can be locally modulated, enabling a more uniform stress distribution along a bonded joint. Motivated by the need to develop FGAs with well-defined and stable gradients in properties, a new approach is proposed involving the use of thermal/ionizing radiation dual-cure adhesives. To generate adhesives with dual-cure characteristics, a series of epoxy resin formulations containing a reactive liquid rubber-based additive that is rich in unsaturation have been developed. Networks are thermally cured and then subjected to γ irradiation, and their capacity to undergo secondary crosslinking reactions is examined via chemical, thermal, and mechanical characterization. While the addition of large concentrations of liquid rubber additives can result in an initial reduction in properties such as modulus and glass transition temperature, their addition can significantly boost radiation sensitivity, enabling the realization of large, well-controlled variations in properties as a function of radiation dose. A facile method is then utilized to create materials with gradients in hardness, confirming the potential of such formulations to generate FGAs. Additionally, the behavior of these radiation sensitive resins is successfully described by a model proposed by Shibayama. This model provides a useful means to predict the glass transition temperatures of dual-cure epoxy resins following radiation-induced crosslinking and provides additional insights into molecular-level behavior of these networks. This effort highlights the promise of this generalized approach for the formation of FGAs based on the careful design and processing of systems sensitive to both thermal and radiation curing.
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