Surface Photon‐Engineered Infrared‐Black Metametal Enabled Enhancement of Heat Dissipation
Surface Photon‐Engineered Infrared‐Black Metametal Enabled Enhancement of Heat Dissipation
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DOI：
10.1002/adfm.202205016
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发表时间：
2022-09
影响因子：
19
通讯作者：
Yanpei Tian;Xiaojie Liu;Lijia Xie;Shilin Xu;Fangqi Chen;Ying Mu;Yang Liu;Marilyn L. Minus;Y. Zheng
中科院分区：
文献类型：
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作者：
Yanpei Tian;Xiaojie Liu;Lijia Xie;Shilin Xu;Fangqi Chen;Ying Mu;Yang Liu;Marilyn L. Minus;Y. Zheng
散热是越来越小和功能化的电子产品的严重障碍，需要不断开发可访问的，具有成本效益的和高效的冷却解决方案。具有高导热性的金属，例如银和铜，可以有效地去除热量。然而，超低的红外热发射率（<0.03）严重限制了它们的辐射散热能力。在此，我们展示了一种溶液处理的化学氧化反应，用于将“红外白色”金属（高红外热反射率）转变为“红外黑色”金属（高红外热发射率）。通过金属-氧化学键的强分子振动，这种通过在金属表面组装纳米结构金属氧化物薄膜的策略产生红外光谱操纵，高和全向热发射率（从0到60°为0.94），具有优异的热机械稳定性。具有相对高的导热率的金属氧化物薄膜不会阻碍散热。在2418 W m−2的加热功率下，“红外黑”Meta合金显示出21.3 °C的温度下降，对应于比原始铝合金提高17.2%的冷却效率。这种表面光子工程策略与铜和钢等其他金属兼容，并扩大了其加速散热的实施范围。
Heat dissipation is a severe barrier for ever‐smaller and more functionalized electronics, necessitating the continuous development of accessible, cost‐effective, and highly efficient cooling solutions. Metals, such as silver and copper, with high thermal conductivity, can efficiently remove heat. However, ultralow infrared thermal emittance (<0.03) severely restricts their radiative heat dissipation capability. Here, a solution‐processed chemical oxidation reaction is demonstrated for transfiguring “infrared‐white” metals (high infrared thermal reflectance) to “infrared‐black” metametals (high infrared thermal emittance). Enabled by strong molecular vibrations of metal‐oxygen chemical bonds, this strategy via assembling nanostructured metal oxide thin films on metal surface yields infrared spectrum manipulation, high and omnidirectional thermal emittance (0.94 from 0 to 60°) with excellent thermomechanical stability. The thin film of metal oxides with relatively high thermal conductivity does not hinder heat dissipation. “Infrared‐black” meta‐aluminum shows a temperature drop of 21.3 °C corresponding to a cooling efficiency of 17.2% enhancement than the pristine aluminum alloy under a heating power of 2418 W m−2. This surface photon‐engineered strategy is compatible with other metals, such as copper and steel, and it broadens its implementation for accelerating heat dissipation.