Effect of the oxygen content of pure copper powder on selective electron beam melting
Effect of the oxygen content of pure copper powder on selective electron beam melting
复制标题
纯铜粉含氧量对电子束选区熔炼的影响
DOI：
10.1016/j.msea.2020.139106
复制
发表时间：
2020-03-27
期刊：
影响因子：
6.4
通讯作者：
Koerner, Carolin
中科院分区：
文献类型：
--
作者：
Guschlbauer, Ralf;Burkhardt, Alex K.;Koerner, Carolin
由于电子束的特殊性质，使用选择性电子束熔化的增材制造对于制造纯铜部件很有吸引力。在这项贡献中，加工了具有不同氧含量的两种不同批次的铜粉。使用高氧含量粉末生产的样品出现裂纹，而使用低氧含量粉末生产的样品没有裂纹。研究了无裂纹样品的机械性能，并与锻造和退火铜进行了比较。
Additive Manufacturing using Selective Electron Beam Melting is attractive to fabricate pure copper components due to the specific properties of the electron beam. In this contribution, two different copper powder batches with different oxygen levels are processed. The samples produced using the powder with high oxygen level show cracks, whereas samples from the powder with low oxygen content are crack-free. The mechanical properties of the crack-free samples are investigated and compared to wrought and annealed copper.