Effects of the high-pressure annealing process on the reflow phenomenon of copper interconnections for large scale integrated circuits
Effects of the high-pressure annealing process on the reflow phenomenon of copper interconnections for large scale integrated circuits
复制标题
高压退火工艺对大规模集成电路铜互连回流现象的影响
DOI：
10.1016/s0040-6090(02)01120-3
复制
发表时间：
2003
期刊：
影响因子：
2.1
通讯作者：
A. Miyagaki
中科院分区：
文献类型：
--
作者：
Onishi Takashi;Hideo Fujii;T. Yoshikawa;J. Munemasa;Takao Inoue;A. Miyagaki
