Surface and bulk micromachined dual back-plate condenser microphone
Surface and bulk micromachined dual back-plate condenser microphone
复制标题
表面和体微机械双背板电容式麦克风
DOI：
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发表时间：
2005
期刊：
影响因子：
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通讯作者：
M. Sheplak
中科院分区：
文献类型：
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作者：
D.T. Martin;K. Kadirvel;R. Fox;T. Nishider;J. Liu;M. Sheplak
本文介绍了一种双背板电容传声器的设计、制作和特性。该麦克风专为航空声学应用而设计，其中高动态范围和高带宽是关键要求。它是在桑迪亚国家实验室使用SUMMiT V工艺制造的。麦克风有一个2.25 /spl mu/m厚的圆形振膜，半径为230 /spl mu/m，每个背板之间的间隙为2 /spl mu/m。该器件的灵敏度为282 /spl mu/V/Pa，线性响应高达160 dB，在1 Hz频段中1 kHz时的本底噪声为42 dB//spl radic/Hz，平坦的频率响应高达20 kHz，理论带宽超过100 kHz。
This paper presents the design, fabrication, and characterization of a dual back-plate condenser microphone. The microphone was designed for aeroacoustic applications where a high dynamic range and high bandwidth are key requirements. It was fabricated using the SUMMiT V process at Sandia National Laboratories. The microphone has a 2.25 /spl mu/m thick circular diaphragm with a 230 /spl mu/m radius and 2 /spl mu/m gap between each back-plate. The device has demonstrated a sensitivity of 282 /spl mu/V/Pa, a linear response up to 160 dB, a noise floor of 42 dB//spl radic/Hz at 1 kHz in a 1 Hz bin, and a flat frequency response up to 20 kHz; the theoretical bandwidth exceeds 100 kHz.