Integrated facility layout and material handling system design in semiconductor fabrication facilities
Integrated facility layout and material handling system design in semiconductor fabrication facilities
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DOI：
10.1109/66.618209
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发表时间：
1997-08
影响因子：
2.7
通讯作者：
B. Peters;Taho Yang
中科院分区：
文献类型：
--
作者：
B. Peters;Taho Yang
半导体制造业是美国制造业的重要组成部分。大多数今天的制造设施和那些正在设计的不久的将来使用一个海湾布局配置和高架单轨系统之间的海湾移动材料。这些材料处理系统通常被设计成具有脊柱或周边类型的构造。本文研究了半导体制造设施中的布局和物料搬运系统设计集成问题，并提出了一种解决这一集成设计问题的方法。一个空间填充曲线的方法是用来解决设施布局，而脊柱和周边配置的结构被利用来创建一个网络流问题，以确定物料搬运系统的设计。计算结果，并显示特殊的承诺，这一过程中解决集成设计问题的半导体制造环境。
Semiconductor manufacturing is an important component of the U.S. manufacturing industry. Most of today's fabrication facilities and those being designed for the near future use a bay layout configuration and an overhead monorail system for moving material between bays. These material handling systems are usually designed with a spine or perimeter type of configuration. This paper investigates the layout and material handling system design integration problem in semiconductor fabrication facilities and proposes a methodology for solving this integrated design problem. A spacefilling curve approach is used to address the facility layout, while the structure of the spine and perimeter configurations are exploited to create a network flow problem to determine the material handling system design. Computational results are presented and show exceptional promise for this procedure in solving the integrated design problem in a semiconductor manufacturing environment.