Sputtered Pt electrode structures with smoothly tapered edges by bi-layer resist lift-off
Sputtered Pt electrode structures with smoothly tapered edges by bi-layer resist lift-off
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DOI：
10.1016/j.tsf.2015.11.026
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发表时间：
2015-12-31
期刊：
影响因子：
2.1
通讯作者：
Seidel, Helmut
中科院分区：
文献类型：
--
作者：
Preiss, Elisabeth M.;Krauss, Andreas;Seidel, Helmut
使用由顶部的图像反转抗蚀剂和底部的剥离抗蚀剂组成的双层抗蚀剂的剥离工艺用于结构化Ti-Pt薄膜。通过该工艺图案化的DC磁控溅射金属膜显示出超光滑的边缘，非常适合于诸如电阻式气体传感器中的叉指电极的应用，包括厚度低于100 nm的基于薄膜的敏感涂层。通过扫描电子显微镜和表面轮廓仪分析加工结构的轮廓。通过使用不同的抗蚀剂厚度和底切长度来控制厚度分布和结构宽度。结果进行了比较与迭代模拟的几何阴影模型，预测欠溅射长度和轮廓结构的实验制造的样品在良好的协议。靶-基片距离的变化被发现只有一个微小的溅射结果的影响。(C)2015爱思唯尔B. V.保留所有权利。
A lift-off process using a bi-layer resist consisting of an image reversal resist on top and a lift-off resist at the bottom was used to structure Ti-Pt thin films. DC magnetron sputtered metal films patterned by this process show ultra smooth edges, ideal for applications such as interdigitated electrodes in resistive gas sensors including thin-film based sensitive coatings with thicknesses below 100 nm. Profiles of processed structures were analyzed by scanning electron microscopy and surface profilometer. The thickness profile and structure width were controlled by using different resist thicknesses and undercut lengths. Results were compared with iterative simulations by a geometric shadowing model, predicting undersputtering length and profile structure of the experimentally manufactured samples in good agreement. Target-to-substrate distance variation was found to have only a minor influence on the sputtering result. (C) 2015 Elsevier B.V. All rights reserved.