Plastic ball grid array (PBGA) overview
Plastic ball grid array (PBGA) overview
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塑料球栅阵列 (PBGA) 概述
DOI：
10.1016/0254-0584(95)80004-2
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发表时间：
1995
影响因子：
4.6
通讯作者：
A. Mawer
中科院分区：
文献类型：
--
作者：
Jay J. Liu;H. Berg;Y. Wen;S. Mulgaonker;R. Bowlby;A. Mawer
随着集成电路功能和时钟速度的不断提高，对创新封装方法的需求也越来越大。最近，塑料球栅阵列（PBGA）技术已经获得了业界的广泛关注和承诺，作为高I/O器件甚至一些较低引脚数应用的潜在成本最低的封装。驱动因素包括区域阵列的密度优势、利用现有组装设备快速实现六西格玛组装产量、出色的电气和热性能潜力以及沿着传统的低成本塑料封装。由于一些被认为的弱点正在被消除，世界范围内对PBGA的评价已经加快。尽管人们经常讨论这项技术的各个方面，但总体评估仍在制定中。在本文中，PBGA技术的系统和全面的评估将被描述，以确定（1）其技术优势和局限性，（2）独特的应用领域，PBGA是选择的包，（3）目前的主要障碍，接受PBGA和可能的方法来克服这些问题。将PBGA与PQFP、CQFP和CBGA在封装特性及其对系统组装的影响方面进行比较。特征包括包属性（即，封装尺寸、I/O计数和引线间距），性能（即，电、热）和可靠性（湿度）。在系统级，焊点疲劳、电路板布线、焊料组装良率、焊料可修复性和电路板延迟是关键指标。将讨论各种一揽子家庭的成本影响。与SMT类似，PBGA的基础设施需要时间来开发。将讨论这一基础设施的关键要素和现状。
As integrated circuit functionality and clock speed continue to rise, innovative packaging approaches are in great demand. Recently, the plastic ball grid array (PBGA) technology has been gaining industry-wide interest and commitment as the potentially lowest-cost package for high-I/O devices and even for some lower-pincount applications. Drivers include the density advantages of an area array, quickly achieving six-sigma assembly yields with existing assembly equipment, the potential for excellent electrical and thermal performance, along with the traditional low cost of plastic packages. Because some perceived weaknesses are being eradicated, worldwide evaluation of the PBGA has accelerated. Although various aspects of this technology are discussed frequently, an overall assessment is still under development. In this paper, a systematic and comprehensive evaluation of PBGA technology will be described to identify (1) its technical advantages and limitations, (2) unique application areas where PBGA is the package of choice, and (3) current major hurdles for acceptance of PBGA and possible approaches to overcome these problems. The PBGA will be compared with PQFP, CQFP and CBGA in terms of package characteristics and their impact on system assembly. The characteristics include package attributes (i.e., package size, I/O counts and lead pitch), performance (i.e., electrical, thermal) and reliability (moisture). At the system level, solder joint fatigue, board routing, solder assembly yield, solder reparability and board delay are key metrics. The cost implication of various package families will be discussed. By analogy with SMT, the infrastructure for PBGA will take time to develop. The key elements and the current status of this infrastructure will be discussed.