Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface
Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface
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DOI：
10.1007/s11664-010-1380-4
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发表时间：
2010-09
影响因子：
2.1
通讯作者：
Bite Zhou;T. Bieler;Tae-Kyu Lee;K. Liu
中科院分区：
文献类型：
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作者：
Bite Zhou;T. Bieler;Tae-Kyu Lee;K. Liu
