Yasuo TAKAHASHI Souta MATSUSAKA Katsunori INOUE: "Numerical Analysis of the Room Temperature Adhering Process of Au fine Wiles-Theoretical Idea to Reduce the Residual Stress on the Bond interface-" Proceeding of 3rd Symposium on "Microjoining and Assembly
Yasuo TAKAHASHI Souta MATSUSAKA Katsunori INOUE: "Numerical Analysis of the Room Temperature Adhering Process of Au fine Wiles-Theoretical Idea to Reduce the Residual Stress on the Bond interface-" Proceeding of 3rd Symposium on "Microjoining and Assembly
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Yasuo TAKAHASHI Souta MATSUSAKA Katsunori INOUE：“Au Fine Wiles 室温粘合过程的数值分析-减少键合界面残余应力的理论思想-”第三届“微连接与装配”研讨会论文集
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