Overlap junctions for high coherence superconducting qubits
Overlap junctions for high coherence superconducting qubits
复制标题
高相干超导量子位的重叠结
DOI：
10.1063/1.4993937
复制
发表时间：
2017
影响因子：
4
通讯作者：
D. Pappas
中科院分区：
文献类型：
--
作者：
Xian Wu;J. Long;J. Long;H. Ku;R. Lake;M. Bal;D. Pappas
亚微米约瑟夫森结的制造证明使用标准的高相干性，超导量子比特的处理技术。这些结是在两个独立的光刻步骤与法向角蒸发。最重要的是，这项工作表明，它是可以实现高的连贯性与结上形成的铝表面上原位清洗的Ar等离子体在结氧化之前。这种方法消除了通常用于小结的角度依赖性阴影掩模。因此，这有利于使用常规CMOS工艺来实现用于提高裕度和良率的典型方法。目前的方法使用电子束光刻和附加工艺来定义顶部和底部电极。扩展这项工作的光学光刻和减法过程进行了讨论。
Fabrication of sub-micron Josephson junctions is demonstrated using standard processing techniques for high-coherence, superconducting qubits. These junctions are made in two separate lithography steps with normal-angle evaporation. Most significantly, this work demonstrates that it is possible to achieve high coherence with junctions formed on aluminum surfaces cleaned in situ by Ar plasma before junction oxidation. This method eliminates the angle-dependent shadow masks typically used for small junctions. Therefore, this is conducive to the implementation of typical methods for improving margins and yield using conventional CMOS processing. The current method uses electron-beam lithography and an additive process to define the top and bottom electrodes. Extension of this work to optical lithography and subtractive processes is discussed.
影响因子：
3.7
作者：
Braumueller, Jochen;Cramer, Joel;Weides, Martin
通讯作者：
Weides, Martin
影响因子：
4
作者：
Braumueller, Jochen;Sandberg, Martin;Pappas, David P.
通讯作者：
Pappas, David P.