Focused-electron-beam-induced deposition of freestanding three-dimensional nanostructures of pure coalesced copper crystals
Focused-electron-beam-induced deposition of freestanding three-dimensional nanostructures of pure coalesced copper crystals
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纯聚结铜晶体的独立式三维纳米结构的聚焦电子束诱导沉积
DOI：
10.1063/1.1517180
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发表时间：
2002
影响因子：
4
通讯作者：
P. Buffat
中科院分区：
文献类型：
--
作者：
I. Utke;A. Luisier;P. Hoffmann;D. Laub;P. Buffat
报道了利用聚焦电子束(FEB)和金属有机前驱体HFAC-Cu-TMVS直接写入铜的三维独立纳米结构。独立的水平棒沉积在大约10μm的长度上，由分散在含有碳、氟、硅和氧的无定形基质中的2-5 nm小的铜纳米晶组成。独立的水平棒被用作进一步垂直沉积的支撑物，导致尺寸高达100 nm的聚结的多面纳米铜纳米晶的尖端。5-6 nm/S的沉积速率几乎不变，而体相载体上的垂直针尖的沉积速率从23 nm/S下降到10 nm/S。以上结果表明，这是一个由电子能量吸收引起的热分解过程。
We report on direct writing of three-dimensional freestanding nanostructures of Cu by use of a focused electron beam (FEB) and the metalorganic precursor hfac-Cu-TMVS. Freestanding horizontal rods were deposited over about 10 μm length and consist of small 2–5 nm Cu nanocrystals dispersed in an amorphous matrix containing carbon, fluorine, silicon, and oxygen. The freestanding horizontal rods were used as support for further vertical deposits resulting in tips of coalesced facetted Cu nanocrystals of up to 100 nm in size. The almost constant deposition rate of 5–6 nm/s is in contrast to vertical tips on bulk supports, which show a deposition rate decreasing from 23 to 10 nm/s. The above results suggest a thermal decomposition process induced by electron energy absorption.